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HIDAR NEW MATERIAL GROUP LIMITED
HIDAR NEW MATERIAL GROUP LIMITED
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Low pressure molding Adhesive for Battery, PCBs, wire, strong adhesive, same as

HIDAR NEW MATERIAL GROUP LIMITED

Low pressure molding Adhesive for Battery, PCBs, wire, strong adhesive, same as

Low pressure molding Adhesive for Battery, PCBs, wire, strong adhesive, same as

Same as Henkel, Strain relief for wire harnesses and cables, strong adhesive, Encapsulation and Sealing of Connectors/Battery, Car adhesive, PA adhesive, Low pressure molding Adhesive, Polyamide ...

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